Copper Crown Copper Foil: HVLP copper foil has entered the supply chain of multiple leading CCL manufacturers with full orders.
Jin10 data reported on July 17 that Tongguan Copper Foil announced the investor relations activity record form, stating that HVLP copper foil, which stands for ultra-low profile copper foil, has an extremely low surface roughness, excellent signal transmission performance, low loss characteristics, and extremely high stability. It is a specialized core material for ultra-low loss high-frequency high-speed circuit boards and can be widely used in 5G communication and AI fields. Currently, this product has successfully entered the supply chain of multiple leading CCL manufacturers, with full orders. The company has production capabilities for 1st to 4th generation HVLP copper foil, primarily focusing on the shipment of 2nd generation products.